0.25 mm thermal bonding tape

Thermal bonding tape offered in a 0.25 mm format. Thermal adhesive tape is used at a bonding interface between a component and a heat-dissipating part. The selected construction must satisfy the assembly thickness, thermal path and electrical-insulation requirements together.

Share the interface area and required thermal performance. Confirm thickness tolerance, adhesive and electrical requirements for the selected grade.

The following options describe the product range. Select the exact construction and dimensions with your quotation; series options are not specifications shared by every variant.

• Adhesive interface formats for electronic and LED assemblies.
• Several thickness grades are listed in the thermal tape series.
• Rolls or converted shapes can be discussed for the component layout.

Primary application: Thermal bonding interfaces.

• Heat-sink attachment enquiries
• LED heat-dissipating assemblies
• Electronic components and battery mounting enquiries

• Thickness grade and finished cut dimensions
• Adhesive, carrier and release liner
• Thermal and electrical requirements for the exact assembly

1. Specify the contact area, surface flatness and available interface thickness.
2. Clean the contact surfaces and apply the tape without trapped air.
3. Validate the operating temperature and electrical requirements on the assembled product using the selected grade.

Samples, custom cutting and packaging can be discussed for the selected construction. Sample charges, minimum order quantity, production time and freight are confirmed for the requested specification and quantity.

For a useful quotation, include:

• Component and heat-sink drawings or dimensions
• Required thickness, thermal path and electrical isolation
• Operating conditions, quantity and sample requirements

Published dimensions are selection references. Request confirmation of the selected grade, tolerances and any required performance data before placing an order.